

Flagship Core for multi-hall data centers and campuses that need maximum on-prem collectors, retention and AI headroom.
- 4U rackmount
- Highest channel and retention headroom
- Multi-hall DC and large campuses
Specifications
- Dimensions
- 4U rack · 482.6 × 177 × ~550 mm (W × H × D, approx.)
- Weight
- ~14 kg (approx.)
- Mounting
- 19″ rack ears · dual PSU bay options
- Input voltage
- DC input · redundant rail options for RFQ
- Power consumption
- Typical < 250 W under dense protocol / multi-AI load
- Cooling
- Highest thermal headroom in Core family
- Compute
- Top-tier industrial CPU / GPU options vs 2U
- Memory
- 32–128 GB RAM options
- Storage
- Largest SSD / NVMe options for campus retention and AI
- Networking
- 2× GbE RJ45 · 2× SFP (expandable)
- Wireless / cellular
- Optional via USB / partner modem
- Operating temperature
- Multi-hall DC / campus MDF · 0–40 °C
- Humidity
- 10–90% RH non-condensing
- Software
- Sentrinel Core + UIIM · flagship on-prem collectors / AI
- Certifications
- CE / FCC class pathway (confirm per lot)
- Warranty
- 12 months standard · extendable
Ports & interfaces
- Expanded I/O bay vs Core 2U for multi-hall collectors
- USB · dual GbE · dual SFP · industrial terminals
- Suited for multi-hall DC and large campus MDF
Marketing specs provisional — confirm dimensions and PSU for RFQ. Datasheet PDF forthcoming.
Tell us the problem — we'll shape the solution.
A short discussion. No pitch theater. We listen, then compose a clear path.